Senmay Seiko has gradually established a development strategy of "rooting in China and managing the world" in the course of its development. So far, it has many subsidiaries and stationed offices in mainland China, Japan, Germany and Europe. The company’s global layout strategy is to take China, Japan, Germany, and the United States as the four important strategic fulcrums, set up R&D teams and research and development laboratories, grasp the pulse of science and technology, and cooperate with the group’s product development strategy and the global important strategy of customer product development needs. Carry out research and development of new products and create new growth points in the global market. Focusing on mainland China, it combines product introduction, design and sample preparation, engineering services and large-scale, high-efficiency, low-cost, and high-quality vertical integrated manufacturing advantages to provide customers with the most competitive technology products!

Research & Development

We work on the research and development of new materials, resin molding technologies, and microfabrication to further improve the level of the mold-manufacturing and resin-molding technologies that we have developed over many years and to create innovative technology. Achievements made through these research and development efforts are applied not only to the semiconductor field but also to other fields such as optics, healthcare, biochemistry.

Coating Technology

Ceramics coating, which is our proprietary coating technology, is a coating technology that greatly improves the durability, releasability and antifouling properties of molds as compared with conventional coatings. It has been used not only for mold chases but also in a wide range of fields including pharmaceutica tableting machines, machine sliding parts of equipment, surface treatment to glass and the like.

Ultra-Precision/Microfabrication Technology

In order to make products smaller with higher performance, ultra precision micofabrication technology to minaturize constituent parts with high precision is necessary. At Senmay Seiko, we undertake research and development from a wide range of perspectives related to ultra-precision micro-fabrication, including the environment, devices, equipment, measurement, evaluation, tools, materials, and processing methods, it is compatible with various processing materials such as metal, resin and ceramics.

Mold Design Technologies

We design molds using a system where the processes from the creation of product drawings, layout, and the arrangement of parts to the creation of data for processing are automated based on 3D CAD data. To ensure optimal designs, we also examine the molds before producing them through CAE analysis using 3D data.

Plastic Molding Technologies/Transfer Molding and Compression Molding

In semiconductor plastic encapsulation technology, molding can be roughly divided into transfer and compression methods. Since establishing industry standards by developing the world’s first fully automated semiconductor plastic encapsulation equipment with multi plunger, Senmay Seiko has been the leading company in the semiconductor molding market. In addition to transfer systems boasting many years of experience, we propose a molding process that stays ahead of the needs of the market with the newly developed compression method as state-of-the-art encapsulation technology.

Press Design Technologies

We have been developing, manufacturing and selling semiconductor manufacturing equipment for many years. By taking advantage of our extensive track record, we design press modules in a manner that optimizes the shape of every single component part.

We provide high-precision, high-quality transfer molds and compression molds by utilizing our advanced design technologies and analysis technologies.

We design molds using a system where the processes from the creation of product drawings, layout, and the arrangement of parts to the creation of data for processing are automated based on 3D CAD data. To ensure optimal designs, we also examine the molds before producing them through CAE analysis using 3D data.

Utilizing 3D CAD Data for the Automatic Design of Molds

Based on product drawings and specifications from customers’ requests, we convert them into 3D data and integrate them with our database enabling efficient mold designing. Design quality improvement and speed up of the design process can be achieved by automating several tasks such as searching and configuring design data.

Optimizing Design Contents through CAE Analysis

The role design plays in mold manufacturing is important. Especially, since resin flow behavior is a big problem related to the customer's production cost, it is necessary to reveal the issues affecting quality and productivity in the early stages of mold design and development and reflect it in the design.

We have been conducting analytical research on resin flow behavior from both numerical calculations and actual results. From years of research and development, we have established a technology for the 3D analysis of resin flow in molds based on CAE, and we make use of this technology for mold design.

Problems with resin flow in molds can cause external defects such as voids, wire sweep leading to short circuit, or internal air bubbles resulting in cracks, for example, which reduce the product yield. We make use of CAE analysis techniques for reducing the risk of defects, and design molds taking into account the most suitable conditions for customer's products and optimal quality and productivity.

We contribute through superior technical strength and technology,ultra-fine processing.

The origins of Senmay Seiko lie in die manufacturing. The Company deploys CAD in all phases of production of press dies, which produce metal products, and mold dies. CAD is involved in all phases of production at Senmay Seiko, from design of CAD data to material procurement and creating programs for machine processing.An important feature of Shenzhen and DongGuan Plant is an environment that supports the formation of a cooperative system linking technology and manufacturing. This cooperative system is vital to Senmay Seiko’s delivery of high-quality products.

Through the relentless pursuit of precision and proactive capital investment, Senmay Seiko has achieved precision to within less than 0.001mm in its finished dies.

Supporting that precision is none other than the technical capabilities of Senmay Seiko’s outstanding technicians.

Processing in the field of high-precision components requires exhaustive knowledge and experienced technique.By fusing creative design that understands customer needs with state-of-the-art processing equipment and superior skills, Senmay Seiko achieves processing at the ultrafine level.

Perform mold design (DFM)

DFM (Design for Manufacturing / Manufacturability) is a general engineering technology that designs products so that they are easy to manufacture. The basic idea exists in almost all engineering disciplines, but of course the exact details depend on the manufacturing technology. This design practice focuses not only on the design side of the part, but also on the production side. Simply put, it's relatively easy to manufacture products, parts, and assemblies.

In the design, development, and production of Moribi Seiko's high-precision molded parts and resin parts, when we first see parts that seem to be more complicated than usual, it is likely that the work of the design team will be adjusted to the work of the research and development team. When that happens, a standard DFM report occurs to bring your thoughts and ideas to life.

Moribi Seiko's DFM report is usually created in about 72 hours and consists of the following two parts.

1. Customer request information collection

2. Mold and parts CAE analysis

Wall Thickness Analysis: Determine wall thickness from material flow to avoid shrinkage and underfill.

Mold Extraction Analysis - Determine the parting line of the part and add some extraction slopes for easier release.

3D Structural Analysis - Check if there are any positions that need to be removed for review and significant simplification of the mold structure. Mold structure is determined from the three-dimensional structure of the mold. In other words, it includes skillfully removing the parts so that they can be mass-produced.

*If diagonal upward action is required. View dynamic effects in 3D.

*If you want slider behavior. Please indicate the direction of movement of the slider.

*If you need other accessories.

Mold flow analysis - determination of injection gates (gate type, number of gates, gate location, etc.), determination of cooling system (cold water channel layout, diameter, etc.).Mold Layout - Shows the mold layout, a 2D view of the mold.